OptoElectronics Packaging Design Engineer

  • Job ref:


  • Location:

    Northampton, Northamptonshire

  • Sector:


  • Job type:


  • Salary:

    £45000 - £65000 per annum + excellent benefits

  • Contact:

    Phil Johnson

  • Email:

  • Published:

    over 1 year ago

  • Start date:

    Q1 2021

  • Consultant:


OptoElectronics Packaging Design Engineer

+ PIC packaging role - Photonic Integrated Circuits

+ Optical sub-assemblies

+ E2E Process - design & manaufacture

+ The #1 OptoElectronics role in the world

+ Northampton based role

+ £40,000 - £65,000 per annum

+ Share Options, Bonus, 9% Pension

+ Excellent benefits

+ Applications invited from worldwide candidates

The role is around getting products cheaper, smaller with more functionality.

++ Working on the next generation of Optical Components

The role as a Design engineer will work as part as the transmission components development team to design high performance transmitters and receivers for use in optical communication systems. The role will work closely with the chip design and NPI (New product introduction) process team to deliver cost effective, manufacturable products into manufacture.


+ Design and development of transmitter and receiver optical sub-assemblies

+ Work with RF/optical experts to generate designs for integrated, high performance components

+ Input to the design, build and assembly processes

+ Specification of photonic integrated circuits, optical and interfacing components required

+ Liaising with NPI and manufacturing teams to ensure that product designs are manufacturable and to support their introduction to manufacture

+ Data analysis and testing to verify product meets performance requirementsDevelop new assembly concepts to simplify manufacturing, improve yields and reduce product cost

+ Provide technical support to production line to resolve yield issues on established products


Honours degree or equivalent in physics, optics, material science or equivalent technical discipline


+ Experience in package design for high speed electronic or optoelectronic components

+ Knowledge of packaging materials and processes for electronic or optoelectronic components

+ Ability to plan out tasks and meet required deadlinesDemonstrated ability to work with multiple teams across various sites


+ Knowledge in flip chip, miniaturisation of packages, microwave packaging, chip on board

+ Lab evaluation of optical components

+ Proven 5 years+ experience in optical sub assembly package design

Salary to £65,000 per annum with strong benefits including:

+ 25+ Days holiday per year

+ Relocation allowance

+ Upto 9% Pension contribution

+ International travel, and other benefits