Packaging Design Engineer - ICs, RF

  • Job ref:


  • Location:

    Northamptonshire, England

  • Sector:


  • Job type:


  • Salary:

    £45000 - £62000 per annum + excellent benefits

  • Contact:

    Phil Johnson

  • Email:

  • Published:

    over 2 years ago

  • Start date:

    Jan 2020

  • Consultant:


Packaging Design Engineer - ICs, RF Devices

Transmitter/Receiver Packaging Design Engineer

+ Semiconductor packaging role
+ Optical sub-assemblies
+ E2E Process - design & manaufacture
+ The #1 OptoElectronics role in the world
+ Northampton based role

The role is around getting products cheaper, smaller with more functionality.

++ Working on the next generation of Optical Components

The role as a Design engineer will work as part as the transmission components development team to design high performance transmitters and receivers for use in optical communication systems. The role will work closely with the chip design and NPI (New product introduction) process team to deliver cost effective, manufacturable products into manufacture.

Design and development of transmitter and receiver optical sub-assemblies
Work with RF and optical experts to generate designs for highly integrated, high performance components
Input to the design, build and assembly processes
Specification of photonic integrated circuits, optical and interfacing components required
Liaising with NPI and manufacturing teams to ensure that product designs are manufacturable and to support their introduction to manufacture
Data analysis and testing to verify product meets performance requirements
Develop new assembly concepts to simplify manufacturing, improve yields and reduce product cost
Provide technical support to production line to resolve yield issues on established products

Honours degree or equivalent in physics, optics, material science or equivalent technical discipline
Experience in package design for high speed electronic or optoelectronic components
Knowledge of packaging materials and processes for electronic or optoelectronic components
Ability to plan out tasks and meet required deadlines
Demonstrated ability to work with multiple teams across various sites
Knowledge in flip chip, miniaturisation of packages, microwave packaging, chip on board
Lab evaluation of optical components
Proven 5 years+ experience in optical sub assembly package design

Salary to £62,000 per annum with strong benefits including:
+ 25+ Days holiday per year
+ Relocation allowance
+ Upto 9% Pension contribution
+ International travel, and other benefits