Principal Manufacturing Process Engineer

  • Job ref:


  • Location:

    Northampton, Northamptonshire

  • Sector:


  • Job type:


  • Salary:

    £60000 - £75000 per annum + bonus, SOs, excellent bens

  • Contact:

    Phil Johnson

  • Email:

  • Published:

    11 months ago

  • Start date:

    October 2021

  • Consultant:


Principal Manufacturing Process Engineer

+ Market-leading manufacturer of innovative optical and photonic products

+ RF Packaging and Interconnection Technologies

+ £60,000 to £75,000 per year salary

+ Bonus, stock options and excellent benefits

+ Northampton based and relocation assistance available

Join a market-leading manufacturer of innovative optical and photonic products enabling optical networking and commercial laser customers worldwide. The clients optical components and subsystems are part of virtually every type of telecom, enterprise, and data center network.

The Role:

A Principal Manufacturing Process Engineer, experienced in RF packaging and interconnection technologies, to develop innovative assembly processes to allow high-speed RF interconnection for 128G and beyond applications. The candidate will own the development, implementation and transfer to MFG of the new interconnection process.


  • Define and execute all preliminary trials to define the approach to be utilized for the new interconnection process development

  • Work closely with the design team to provide input to guarantee product manufacturability and high automation level (DFM, DFA)

  • Perform benchmarking activity through machine vendors to select the more appropriate assembly equipment, define procurement spec and manage the machine validation

  • Develop the new process on the selected machine through the technological development program

  • Take the ownership of the implementation of the new technology within NPI projects

  • Own the process execution of Pre-Alpha and Alpha builds in the OSA development lab

  • Own the technology transfer to designated manufacturing site to establish manufacturing capabilities for beta and post beta phase

  • Day to day analysis of process yield and capability (Cpk/Ppk) during the technology development, alpha, beta and post beta phase and the implementation of corrective actions and or continuous improvement actions through A3/8D methodology

  • Preparation of validation plan and related verification reports to demonstrate process maturity across the different development phases

  • Preparation of process documentation including PFMEA, Control Plans, Process Flows, Work Instructions, etc.

Education/Qualification - Minimum:

+ Honors degree or equivalent in any scientific or technology-based subject (i.e. Physics)

+ 10+ years work experience in electronics / optoelectronics industry

Skills/Competencies Essential:

+ Proven experience of micro-electronic or optoelectronics assembly techniques, such as: die-bonding, wire-bonding, flip-chip bonding, soldering techniques, precision optical alignment, flex bonding, hermetic sealing

+ knowledge in SMT / BGA / flip chip technology

+ Strong competence in DOE approach, data statistical analysis and SPC control

Good communication skills will be required to communicate with all levels of the business across multiple sites and departments

Skills/Competencies Desirable:

+ Specific experience on optical components

+ Preference will also be given to candidates who can display an understanding of Kaizen (or similar) methodology