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Production Operative - Buckinghamshire

Salary: £18000 - £20000 per annum
Location: Buckinghamshire
Job type: Permanent
Sector: Electronics
Production Operative

Milton Keynes

£20,000

Assembly of RF and Microwave electronic components and /or electro-mechanical assemblies through various process stages, working to defined build procedures and standards in order to meet clearly identified targets.

Must have experience of working on pick and place machines and die testing.

Role and Responsibilities:

+ Assembly of electronic devices using a range of manufacturing tools and equipment such as a pick & place machine and some under high magnification.

+ Work to clearly defined goals with respect to quality, output and timescale.

+ Attend departmental meetings as required & maintain all documentation and records as requested

+ Being flexible between processes where appropriate training has been given.

+ Identify opportunities for continuous improvement and cost reduction

+ Provide timely feedback to supervisor / manager on any technical or quality issues that arise

+ Ensure all work & time is recorded appropriately through the CATS /PDC system

+ Assist with any Lean Six Sigma initiatives as required

Skills and Experience:

+ Ability to work under a microscope and under minimum supervision

+ Basic computer knowledge desirable & good communication skills

+ Previous experience in a similar role within an electronics environment preferred

+ Wire bond process experience ball & wedge required

+ Auto Bonding (wedge/wedge) and Pick and Place experience required

+ Experience with Hesse Knipps auto wire bonders required

+ Experience with Datacon pick & place desired

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Description

Production Operative

Milton Keynes

£20,000

Assembly of RF and Microwave electronic components and /or electro-mechanical assemblies through various process stages, working to defined build procedures and standards in order to meet clearly identified targets.

Must have experience of working on pick and place machines and die testing.

Role and Responsibilities:

+ Assembly of electronic devices using a range of manufacturing tools and equipment such as a pick & place machine and some under high magnification.

+ Work to clearly defined goals with respect to quality, output and timescale.

+ Attend departmental meetings as required & maintain all documentation and records as requested

+ Being flexible between processes where appropriate training has been given.

+ Identify opportunities for continuous improvement and cost reduction

+ Provide timely feedback to supervisor / manager on any technical or quality issues that arise

+ Ensure all work & time is recorded appropriately through the CATS /PDC system

+ Assist with any Lean Six Sigma initiatives as required

Skills and Experience:

+ Ability to work under a microscope and under minimum supervision

+ Basic computer knowledge desirable & good communication skills

+ Previous experience in a similar role within an electronics environment preferred

+ Wire bond process experience ball & wedge required

+ Auto Bonding (wedge/wedge) and Pick and Place experience required

+ Experience with Hesse Knipps auto wire bonders required

+ Experience with Datacon pick & place desired

Production Operative

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