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Packaging Engineer - NPI, Sub-Assembly Manufacturing - Northamptonshire

Salary: £35000 - £44000 per annum + excellent benefits
Location: Northamptonshire
Job type: Permanent
Sector: Computer Aided Design (CAD), Systems
This vacancy has now expired.

Description

Packaging Engineer - NPI, Sub-Assembly Manufacturing

+ World leading OptoElectronics Company

+ Product Engineer - Electronics, Semiconductors - NPI & Packaging

+ NPI and New product Development

+ £35-£44k + excellent benefits

+ Working on 40GB, 100GB and 400GB Products

+ Northampton based role

JOB PURPOSE:

Take the lead role in the transfer of the products from the manufacturing facility to the designated CM, and provide on-going product support to the CM.

Required to perform engineering activities within the photonic components Prototype Line product engineering team. This team is responsible for the product development verification, test and transfer to manufacturing of packaged transmitters, receivers and modules for high bit rate optical communication systems.

The role will involve hands on assessment of new products from concept and prototype stages through to manufacturing.

KEY RESPONSIBILITIES:

Contribute to the development and introduction to manufacture of new packaged components for next generation optical transmission systems through the Product Life Cycle Process.

Feedback into the design of new products, the testing of proto-types to demonstrate product feasibility, and the development and verification of test processes.

Building a close link with the NPI and manufacturing process/product engineering teams will be required to ensure products & process are designed to be manufactured within the tolerance capabilities of the optoelectronic chips and the designated manufacturing equipment.

Close working with R&D engineering with be required to feedback test and performance data and ensure packaging design meets the manufacturing requirements.

Analysis of parametric performance distributions and yields and the management of improvement activities to ensure product cost targets can be met when the products are transferred to a contract manufacturer (CM).

Preparation of reports to complete the stages of product development, and the preparation of product documentation.

Education/Qualification - Minimum:

  • Honours degree or equivalent in physics, electronics, optics or equivalent technical discipline.

Skills/Competencies Essential:

  • Knowledgeable Product Engineer, preferably with experience of optical, electronic, mechanical or product design

  • Optical communications systems, components and design.

  • Practical measurement techniques, data correlation and results analysis

  • Familiarity with the use of software to automate laboratory measurements

  • Analogue and digital design techniques, RF skills would be an advantage

  • Knowledge and experience with the Product Life Cycle and NPI gate review process

  • Manufacturing processes for optoelectronic devices

  • Design for manufacture

Packaging Engineer - NPI, Sub-Assembly Manufacturing

 

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